在使用的过程中会有缺陷:不合格的分发点的大小,大小的针,针之间的距离和PCB,胶温度、胶水粘度、拉丝、胶浸焊垫、固化强度不好,容易降低碎片。为了解决这些问题，需要对技术参数进行整体研究，从而找到问题的解决方案。
　　There will be defects in the process of use: the size of unqualified distribution points, the size of pins, the distance between pins and PCB, bad glue temperature, glue viscosity, wire drawing, glue immersion pad, curing strength, easy to reduce debris. In order to solve these problems, we need to study the technical parameters as a whole to find the solution.
　　1. 上胶量
　　1. sizing
　　根据工作经验，焊点的直径应该是焊盘之间距离的一半，贴片后的胶点直径应该是胶点直径的1.5倍。这将确保有足够的胶水来粘合组件，并避免太多的胶水染垫。由螺杆泵的旋转时间来决定，在实际操作中应根据生产情况(室温、胶水粘度等)来选择泵的旋转时间。
　　According to the work experience, the diameter of the solder joint should be half of the distance between the pads, and the diameter of the glue point after the patch should be 1.5 times of the diameter of the glue point. This will ensure that there is enough glue to bond the components and avoid too much glue to dye the pad. It is determined by the rotation time of the screw pump. In actual operation, the rotation time of the pump should be selected according to the production conditions (room temperature, glue viscosity, etc.).
　　2. 配药压力(背压)
　　2. Dispensing pressure (back pressure)
　　目前的点胶机使用螺杆泵给点胶针软管加压，保证螺杆泵有足够的供胶量。背压过大，容易造成橡胶溢出，橡胶量过大;压力过小会出现点胶间歇现象，漏气，造成缺陷。应根据胶水的质量相同，工作环境的温度来选择压力。较高的环境温度会使胶水的粘度变小，流动性更好，这时需要减少背压以保证胶水的供应，反之亦然。
　　At present, screw pump is used in dispensing machine to pressurize dispensing needle hose to ensure that screw pump has enough glue supply. If the back pressure is too large, it is easy to cause rubber overflow and too much rubber; if the pressure is too small, it will cause intermittent phenomenon of dispensing, air leakage and defects. The pressure should be selected according to the same quality of glue and the temperature of working environment. Higher ambient temperature will make the viscosity of glue smaller and the fluidity better. At this time, it is necessary to reduce the back pressure to ensure the supply of glue, and vice versa.
　　3.针的大小
　　3. Needle size
　　在实践中,针直径大小应该分配胶点直径的1/2,调剂过程中,应该选择根据PCB板分发针头大小,如0805年和1206年的焊盘大小相似,您可以选择同样的针,但对于不同的焊盘会选择不同的针,以确保凝胶点的质量,可以提高生产效率。
　　In practice, the diameter of the needle should be assigned to 1/2 of the glue point diameter. During the dispensing process, the size of the needle should be distributed according to the PCB plate. If the size of the pads in 0805 and 1206 is similar, you can choose the same needle, but different pins will be selected for different pads to ensure the quality of the gel point and improve the production efficiency.
　　4. 针和PCB之间的距离
　　4. Distance between pin and PCB
　　不同的分配器使用不同的针，有些针有一定的停止度(如CAM/A LOT 5000)。每项工作开始时，都要校准针与PCB的距离，即校准z轴高度。
　　Different dispensers use different needles, some of which have a certain stopping degree (such as cam / a lot 5000). At the beginning of each work, calibrate the distance between the needle and PCB, that is, calibrate the z-axis height.

　　5. 水的温度
　　5. Water temperature
　　一般环氧树脂胶应存放在0- 5℃冰箱中，使用时应提前1/2小时取出，使胶液与工作温度完全一致。胶水使用温度为23℃—25℃;环境温度对胶的粘度有很大的影响。5℃的环境温度差异将导致配药量变化50%。因此，应控制环境温度。同时，环境的温度也应给定，以保证湿度小的粘着点容易干燥，影响粘着力。
　　Generally, the epoxy resin glue should be stored in the refrigerator at 0-5 ℃, and taken out 1 / 2 hour in advance when using, so that the glue solution is completely consistent with the working temperature. The temperature of glue is 23 ℃ - 25 ℃; the ambient temperature has a great influence on the viscosity of glue. The difference of ambient temperature at 5 ℃ will result in 50% change of dosage. Therefore, the ambient temperature should be controlled. At the same time, the temperature of the environment should also be given to ensure that the adhesion point with low humidity is easy to dry and affect the adhesion.
　　6. 胶的粘度
　　6. Viscosity of glue
　　胶液的粘度直接影响着胶液的质量。粘度较大时，则胶点会变小，甚至出现拉丝现象;粘度小，胶点会变大，然后可能会渗透到焊盘上。在上胶过程中，应根据胶水的粘度不同，选择合理的背压和上胶速度。
　　The viscosity of glue directly affects the quality of glue. When the viscosity is large, the glue point will become smaller, or even wire drawing will occur; when the viscosity is small, the glue point will become larger, and then it may penetrate into the pad. In the process of gluing, the reasonable back pressure and gluing speed should be selected according to the viscosity of glue.
　　7. 固化温度曲线
　　7. Curing temperature curve
　　对于胶水固化，一般厂家都给出了温度曲线。在实践中应尽量采用高温固化，使固化后的胶水有足够的强度。
　　For glue curing, temperature curves are given by general manufacturers. In practice, high temperature curing should be used as far as possible to make the cured glue have enough strength.
　　以上就是双组份打胶机对全自动封胶机使用注意事项的详细介绍，想要了解更多请点击官网http://www.jncsjx.com
　　The above is a detailed introduction of the two-component gluing machine to the precautions for the full-automatic gluing machine. To learn more, please click the official website http://www.jncsjx.com